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Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.

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Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation.

Electronic packaging – Wikipedia

It can be very economical, but somewhat difficult to achieve consistent process quality. These requirements extend beyond and interact with the electrical design.

It’s usually a dielectric fluid, chosen for chemical compatibility with the other materials present. Glop-top is a variant of conformal coating used in hermiticith assembly COB.

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Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids.

Porosity Sealing or Resin Impregnation is similar to potting, electronoc doesn’t use a shell or a mold.

Views Read Edit View history. An electronics assembly consists of component devices, circuit card assemblies CCAsconnectors, cables and components such as transformers, power supplies, relays, switches, etc. Piece part costs are high, but there is little or no her,iticity for custom tooling, and first-piece deliveries can take as little as half a day. By using this site, you agree to the Terms of Use and Privacy Policy.


Six Sigma: Hermeticity Testing

Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. In some products, such as computer accessory boards, they’re all the structure there is. December Learn how and when to remove this template message.

Articles needing additional references from December All pac,ages needing additional references. Retrieved from ” https: Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure.

The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design Packates files to toolpath command files. It is most commonly used in electronic toys and low-end devices. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes.

The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation. Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. Punched and formed sheet metal is one of the oldest types of electronic packaging.

Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Aluminum die castings are more common than iron or steel sand castings.

This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage. They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex metal shapes, in combination with hermitiicty sealed housings.

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Today, glass-seal packages are used mostly in critical components and assemblies for aerospace use, where leakage must be prevented even under extreme changes in temperature, pressure, and humidity.

Such knowledge is important to prevent immediate or premature electronic product failures. A designer must balance many objectives and practical considerations when selecting packaging methods. This also excludes dirt and conductive contaminants such as impure water from sensitive areas. This page was last edited on 31 Decemberat After the vacuum is released, the fluid og into the part.

Industrial design Packaging Packaging microfabrication Chip carriers.

Electronic packaging

See Conformal coatingParylene. It provides mechanical and chemical protection of delicate components. Quantities tend to be small; sometimes only one unit of a custom design is required.

Liquid filling is sometimes used as an alternative to potting or impregnation. Formally called “encapsulation”, potting consists of immersing the part or assembly in a liquid resin, then curing it.

High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt spray, explosive shock, and many more. It’s widely used on mass-produced items such as axial-lead resistors, and sometimes on printed circuit boards. Pl can be post-processed to provide conductive surfaces.